Purity: ≥99.9%, 99.99%, 99.999%

Common Specifications: Diameter (Φ): ≥20mm, 50-100mm, >100mm; Thickness (T): 2-10mm; Tolerance: ±0.1mm; Dimensions are flexible and customizable

Density: ≥98%

Product and Company Advantages

Holds an absolute advantage in the production of ceramic targets, refractory metal targets, and multi-component metal targets. Utilizing SPS high-temperature sintering, purity reaches up to 5N, grain size is controllable, daily production capacity for small targets is >25 pieces, dimensions are flexible, and delivery is rapid, meeting the stringent requirements of scientific research, experiments, and high-end semiconductor chip manufacturing. Simultaneously provides target material testing services, with 7-15 day fast delivery, accelerating customer product iteration and performance verification, continuously empowering the global target material industry.

Employs globally leading Electron Beam Melting (EB) and Vacuum Arc Remelting (VAR) processes to achieve precise purification of high melting point metals, supporting custom development of ultra-large target ingots/billets (single weight 500kg-2t) with purity levels of 99.99%-99.999%.

The testing center is equipped with advanced detection instruments such as Hitachi scanning electron microscopes (50,000x magnification) and ICP spectrometers, conducting full-process monitoring of over 20 indicators including material composition, grain size, and density, ensuring strict quality control.

Product Series

Metal targets, ceramic targets, binary alloy targets, multi-component alloy targets, high-entropy alloy targets, high-purity metal evaporation materials, compound particles, high-purity target billets, spray powder for targets, etc.

Product Applications

Compatible Processes:

Magnetron Sputtering: Optical coatings, electrochromic applications

Ion Beam Sputtering: High-precision optical components

Pulsed Laser Deposition: Scientific research, functional thin films

Electron Beam Evaporation: Large-area optical coatings