Composition Ratios: Ni-10%Ta, Ni-20%Ta, Ni-30%Ta; Custom compositions available
Common Specifications: Diameter (Φ): ≥20mm, 50-100mm, >100mm; Thickness (T): 2-10mm; Tolerance: ±0.1mm; Dimensions are flexible and customizable.
Theoretical Density & Color: ≥97% Silver-gray metallic luster, color tends to dark gray with high tantalum content
Product and Company Advantages
High purity, high density, fine grain size, low porosity, uniform sputtering, flexible dimensions, any composition customization, strict quality control, rapid delivery. Nickel tantalum alloy targets exhibit unique advantages in the fields of chemical protection, biomedical, and electronic devices by combining the processing performance of nickel with the corrosion resistance of tantalum. Their improved corrosion resistance compared to pure nickel or nickel-chromium alloys, along with their controllable cost compared to pure tantalum, makes them highly competitive in mid-to-high-end applications.
Holds an absolute advantage in the production of ceramic targets, refractory metal targets, and multi-component metal targets. Utilizing SPS sintering technology, purity reaches up to 5N, grain size is controllable, dimensions are flexible, and delivery is rapid, meeting the stringent requirements of scientific research, experiments, and high-end semiconductor chip manufacturing. Simultaneously provides target material testing services, with 7-15 day fast delivery, accelerating customer product iteration and performance verification, continuously empowering the global target material industry.
Employs globally leading Electron Beam Melting (EB) and Vacuum Arc Remelting (VAR) processes to achieve precise purification of high melting point metals, supporting custom development of ultra-large target ingots/billets (single weight 500kg-2t) with purity levels of 99.99%-99.999%.
The testing center is equipped with advanced detection instruments such as Hitachi scanning electron microscopes and ICP spectrometers, conducting full-process monitoring of over 20 indicators including material composition, grain size, and density, ensuring strict quality control.
Product Series
Metal targets, ceramic targets, binary alloy targets, ternary alloy targets, multi-component alloy targets, high-entropy alloy targets, high-purity metal evaporation materials, compound particles, high-purity target billets, spray powder for targets, etc.
Product Applications
Compatible Processes: Magnetron Sputtering (DC/RF), Electron Beam Evaporation (EB-PVD), Multi-Arc Ion Plating
Corrosion-Resistant & High-Temperature Coatings: Chemical equipment protection (reactor vessels, pipeline inner wall coatings); Aero-engine components (turbine blade or combustion chamber coatings)
Electronics & Semiconductor Field: Diffusion barrier layers (for copper interconnect processes); Magnetic thin films (low-tantalum content alloys for magnetic sensors or storage media, tuning hysteresis loop characteristics)
Biomedical & New Energy: Biocompatible coatings (surface modification of orthopedic implants, reducing inflammation and promoting osseointegration); Water electrolysis electrodes (as catalyst support for oxygen evolution reaction, utilizing tantalum’s corrosion resistance to enhance electrode lifespan)