Tantalum Aluminum Alloy Target

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Tantalum Aluminum Alloy Target

Description

Composition Ratios: Ta-5%Al, Ta-10%Al, Ta-20%Al; Custom compositions available

Common Specifications: Diameter (Φ): ≥20mm, 50-100mm, >100mm; Thickness (T): 2-10mm; Tolerance: ±0.1mm; Dimensions are flexible and customizable.

Theoretical Density & Color: ≥98% Silver-gray metallic luster, exhibits a bright metallic finish after surface polishing

Product and Company Advantages

High purity, high density, fine grain size, low porosity, uniform sputtering, flexible dimensions, any composition customization, strict quality control, rapid delivery. The core advantage of tantalum aluminum alloy targets lies in the combination of tantalum’s extreme corrosion resistance with aluminum’s lightweight/oxidation resistance properties, making them suitable for harsh corrosive environments, high-temperature lightweight coatings, and high-reliability electronic devices.

Holds an absolute advantage in the production of ceramic targets, refractory metal targets, and multi-component metal targets. Utilizing SPS sintering technology, purity reaches up to 5N, grain size is controllable, dimensions are flexible, and delivery is rapid, meeting the stringent requirements of scientific research, experiments, and high-end semiconductor chip manufacturing. Simultaneously provides target material testing services, with 7-15 day fast delivery, accelerating customer product iteration and performance verification, continuously empowering the global target material industry.

Employs globally leading Electron Beam Melting (EB) and Vacuum Arc Remelting (VAR) processes to achieve precise purification of high melting point metals, supporting custom development of ultra-large target ingots/billets (single weight 500kg-2t) with purity levels of 99.99%-99.999%.

The testing center is equipped with advanced detection instruments such as Hitachi scanning electron microscopes and ICP spectrometers, conducting full-process monitoring of over 20 indicators including material composition, grain size, and density, ensuring strict quality control.

Product Series

Metal targets, ceramic targets, binary alloy targets, ternary alloy targets, multi-component alloy targets, high-entropy alloy targets, high-purity metal evaporation materials, compound particles, high-purity target billets, spray powder for targets, etc.

Product Applications

Compatible Processes: Magnetron Sputtering, Electron Beam Evaporation

Corrosion-Resistant Coatings: Inner wall coatings for chemical reactors and marine equipment (resistant to hydrochloric acid, seawater corrosion); Anti-radiation coatings for nuclear waste containers

High-Temperature Protection: Oxidation-resistant coatings for aero-engine blades and rocket nozzles (Al₂O₃ protective layer + tantalum’s high-temperature resistance); Electrode coatings for high-temperature sensors

Electronic Devices: Diffusion barrier layers for integrated circuits (inhibiting copper interconnect migration); Conductive layers for flexible circuits (lightweight + high conductivity)

Electromagnetic Shielding: Coatings for electronic device enclosures (combining high conductivity and corrosion resistance)

Decorative Coatings: Matte silver coatings for high-end consumer goods (requires oxidation-resistant treatment)