Purity: ≥99.9%, 99.99%, 99.999%

Common Specifications: Φ≥20mm, 50–100mm, >100mm; Thickness 2–10mm; Tolerance ±0.1mm; Flexible sizing, customizable.

Density: ≥98%

Product and Company Advantages
We hold a definitive advantage in producing ceramic targets, refractory metal targets, and multi-component metal targets. Through SPS high-temperature sintering, we achieve purity levels up to 5N with controllable grain structure. Daily production capacity for small targets exceeds 25 pieces, with flexible sizing and rapid delivery, meeting stringent requirements for scientific research, experimental studies, and high-end semiconductor chip manufacturing. We also provide target material testing services, delivering results in 7–15 days to accelerate customers’ product iteration and performance validation, consistently empowering the global target material industry.

Utilizing world-leading Electron Beam (EB) melting and Vacuum Arc Remelting (VAR) processes, we achieve precise purification of high-melting-point metals, supporting custom development of ultra-large target ingots (single weight: 500kg–2t) with purity levels of 99.99%–99.999%.

Our inspection center is equipped with advanced testing instruments such as a Hitachi scanning electron microscope (50,000x magnification) and ICP spectrometers, enabling full-process monitoring of over 20 indicators including material composition, grain size, and density, ensuring strict quality control.

Series Products
Metal targets, ceramic targets, binary alloy targets, multi-component alloy targets, high-entropy alloy targets, high-purity metal evaporation materials, compound granules, high-purity target blanks, and spray powders for target applications.

Product Applications
Suitable for RF sputtering processes: Smart window phase-change films
PLD processes: Ultrafast optical switching devices
Ion beam deposition processes: Infrared stealth coatings
ALD precursor processes: Three-dimensional storage devices